ECE465
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ECE465 - Microelectronic Packaging Materials
Course ID
022944
Course Description
Design of microelectronic packaging systems based on the electrical, thermal and mechanical properties of materials. Chip, chip package, circuit board and system designs are considered.
Min Units
3
Max Units
3
Repeatable for Credit
No
Grading Basis
GRD - Regular Grades A, B, C, D, E
Career
Undergraduate
Course Attributes
CE - CL (Cross Listed)
Enrollment Requirements
015063
Course Requisites
Cross Listed Courses
May be convened with
ECE565
Component
Lecture
Optional Component
No