ECE565
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ECE565 - Microelectronic Packaging Materials
Course ID
023021
Course Description
Design of microelectronic packaging systems based on the electrical, thermal and mechanical properties of materials. Chip, chip package, circuit board and system designs are considered. Graduate-level requirements include an additional term paper.
Min Units
3
Max Units
3
Repeatable for Credit
No
Grading Basis
GRD - Regular Grades A, B, C, D, E
Career
Graduate
Course Attributes
CE - CL (Cross Listed)
Course Requisites
Cross Listed Courses
May be convened with
ECE465
Component
Lecture
Optional Component
No